GSO IEC 62137-1-3:2015

Gulf Standard   Current Edition
· Approved on 03 September 2015 ·

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Electronic component assemblies
Including preassembled modules

GSO IEC 62137-1-3:2015 Files

GSO IEC 62137-1-3:2015 Scope

The test method described in this part of IEC 62137 applies to solder joints between terminals of surface mounting devices (SMDs) and land patterns on printed wiring boards (PWBs). This test is intended to evaluate the strength of the solder joints of larger sized multi-terminal components and other components in devices (e.g. handheld mobile devices) in the event that the device is dropped. The properties of the solder joints (e.g. solder alloy, substrate, mounted device or design, etc.) are evaluated to assist in improving the strength of the solder joints.

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